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INTEGRATED CIRCUITS
DATA SHEET
TDA1519C 22 W BTL or 2 x 11 W stereo power amplifier
Product specification Supersedes data of 1998 Oct 16 File under Integrated Circuits, IC01 2000 Mar 08
Philips Semiconductors
Product specification
22 W BTL or 2 x 11 W stereo power amplifier
FEATURES * Requires very few external components for Bridge-Tied Load (BTL) * Stereo or BTL application * High output power * Low offset voltage at output (important for BTL) * Fixed gain * Good ripple rejection * Mute/standby switch * Load dump protection * AC and DC short-circuit-safe to ground and VP * Thermally protected * Reverse polarity safe * Capability to handle high energy on outputs (VP = 0 V) * No switch-on/switch-off plop * Protected against electrostatic discharge * Low thermal resistance * Identical inputs (inverting and non-inverting) * Pin compatible with TDA1519B (TDA1519C and TDA1519CSP). ORDERING INFORMATION PACKAGE TYPE NUMBER NAME TDA1519C TDA1519CSP TDA1519CTH TDA1519CTD SIL9P SMS9P HSOP20 HSOP20 DESCRIPTION plastic single in-line power package; 9 leads plastic surface mounted single in-line power package; 9 leads heatsink small outline package; 20 leads; low stand-off heatsink small outline package; 20 leads GENERAL DESCRIPTION
TDA1519C
The TDA1519C is an integrated class-B dual output amplifier in a 9-lead plastic single in-line (SIL) power or 20-lead heatsink small outline package. For the TDA1519CTH (SOT418-2) the heatsink is positioned on top of the package, thereby allowing an external heatsink to be mounted on top. The heatsink of the TDA1519CTD (SOT397-1) is facing the PCB thereby allowing the heatsink to be soldered on the copper area of the PCB.
VERSION SOT131-2 SOT354-1 SOT418-2 SOT397-1
2000 Mar 08
2
Philips Semiconductors
Product specification
22 W BTL or 2 x 11 W stereo power amplifier
QUICK REFERENCE DATA SYMBOL Supplies VP supply voltage operating non-operating load dump protected IORM Iq(tot) Istb Isw(on) Inputs Zi input impedance BTL stereo Stereo application Po output power THD = 10% RL = 4 RL = 2 cs Vn(o)(rms) BTL application Po SVRR output power supply voltage ripple rejection THD = 10%; RL = 4 - RS = 0 f = 100 Hz f = 1 to 10 kHz VOO Tj DC output offset voltage junction temperature 34 48 - - - - - - 22 channel separation noise output voltage (RMS value) - - 40 - 6 11 - 150 25 50 - - repetitive peak output current total quiescent current standby current switch-on current 6.0 - - - - - - 14.4 - - - 40 0.1 - PARAMETER CONDITIONS MIN. TYP.
TDA1519C
MAX.
UNIT
17.5 30 45 4 80 100 40 - -
V V V A mA A A k k
- - - - - - - 250 150
W W dB V W dB dB mV C
2000 Mar 08
3
Philips Semiconductors
Product specification
22 W BTL or 2 x 11 W stereo power amplifier
BLOCK DIAGRAM
TDA1519C
handbook, full pagewidth
NINV
1 60 k
mute switch Cm
VA 183 18.1 k power stage
4
OUT1
VP standby switch VA 15 k x1 RR 3 15 k
+ -
standby reference voltage
8
M/SS
+ + -
mute reference voltage
mute switch
TDA1519C
18.1 k power stage 183 6 VA INV 9 60 k input reference voltage mute switch signal ground 2 GND1 7 VP 5
MGL491
OUT2
Cm
power ground (substrate)
GND2
The pin numbers refer to the TDA1519C and TDA1519CSP.
Fig.1 Block diagram.
2000 Mar 08
4
Philips Semiconductors
Product specification
22 W BTL or 2 x 11 W stereo power amplifier
PINNING PIN SYMBOL NINV GND1 RR OUT1 GND2 OUT2 VP M/SS INV n.c. TDA1519C; TDA1519CSP 1 2 3 4 5 6 7 8 9 -
TDA1519C
DESCRIPTION TDA1519CTD 19 20 1 3 5 8 10 11 12 2, 4, 6, 7, 9 and 13 to 18 TDA1519CTH 2 1 20 18 16 13 11 10 9 3 to 8, 12, 14, 15, 17 and 19 non-inverting input ground 1 (signal) supply voltage ripple rejection output 1 ground 2 (substrate) output 2 positive supply voltage mute/standby switch input inverting input not connected
halfpage
fpage
fpage
NINV 1 GND1 2 RR 3 OUT1 4
RR 1 n.c. 2 OUT1 3 n.c. 4 GND2 5
20 GND1 19 NINV 18 n.c. 17 n.c. 16 n.c.
GND1 1 NINV 2 n.c. 3 n.c. 4 n.c. 5
20 RR 19 n.c. 18 OUT1 17 n.c. 16 GND2
TDA1519C GND2 5 TDA1519CSP
OUT2 6 VP 7 M/SS 8 INV 9
MGR561
TDA1519CTD
n.c. 6 n.c. 7 OUT2 8 n.c. 9 VP 10
MGL937
TDA1519CTH
15 n.c. 14 n.c. 13 n.c. 12 INV 11 M/SS n.c. 6 n.c. 7 n.c. 8 INV 9 M/SS 10
MGL936
15 n.c. 14 n.c. 13 OUT2 12 n.c. 11 VP
Fig.2
Pin configuration (SOT131-2 and 354-1).
Fig.3
Pin configuration (SOT397-1).
Fig.4
Pin configuration (SOT418-2).
2000 Mar 08
5
Philips Semiconductors
Product specification
22 W BTL or 2 x 11 W stereo power amplifier
FUNCTIONAL DESCRIPTION
TDA1519C
The TDA1519C contains two identical amplifiers with differential input stages. The gain of each amplifier is fixed at 40 dB. A special feature of this device is the mute/standby switch which has the following features: * Low standby current (<100 A) * Low mute/standby switching current (low cost supply switch) * Mute condition. LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC 134). SYMBOL VP supply voltage PARAMETER CONDITIONS operating non-operating load dump protected; during 50 ms; tr 2.5 ms Vsc Vrp IOSM IORM Ptot Tj Tstg AC and DC short-circuit-safe voltage reverse polarity voltage energy handling capability at outputs non-repetitive peak output current repetitive peak output current total power dissipation junction temperature storage temperature see Fig.5 VP = 0 V - - - - - - - - - - -55 MIN. MAX. 17.5 30 45 17.5 6 200 6 4 25 150 +150 UNIT V V V V V mJ A A W C C
MGL492
handbook, halfpage
30
Ptot (W) 20
(1)
(2)
10
(3)
0 -25 (1) Infinite heatsink. (2) Rth(c-a) = 5 K/W. (3) Rth(c-a) = 13 K/W.
0
50
100 150 Tamb (C)
Fig.5 Power derating curve for SIL9P.
2000 Mar 08
6
Philips Semiconductors
Product specification
22 W BTL or 2 x 11 W stereo power amplifier
THERMAL CHARACTERISTICS SYMBOL Rth(j-a) TDA1519C TDA1519CTH and TDA1519CTD Rth(j-c) thermal resistance from junction to case TDA1519C TDA1519CTH and TDA1519CTD DC CHARACTERISTICS VP = 14.4 V; Tamb = 25 C; measurements taken using Fig.6; unless otherwise specified. SYMBOL Supplies VP Iq(tot) VO VOO Vsw(on) Vmute VO VOO Vstb Istb Isw(on) Notes 1. The circuit is DC adjusted at VP = 6 to 17.5 V and AC operating at VP = 8.5 to 17.5 V. 2. At VP = 17.5 to 30 V, the DC output voltage 0.5VP. supply voltage total quiescent current DC output voltage DC output offset voltage note 2 note 1 6.0 - - - 8.5 14.4 40 6.95 - - - - - - - 12 PARAMETER CONDITIONS MIN. TYP. 3 3 PARAMETER thermal resistance from junction to ambient CONDITIONS in free air
TDA1519C
VALUE 40 40
UNIT K/W K/W K/W K/W
MAX.
UNIT
17.5 80 - 250 - 6.4 20 250
V mA V mV
Mute/standby switch switch-on voltage level V
Mute condition mute voltage output signal in mute position DC output offset voltage 3.3 VI = 1 V (max.); f = 20 Hz to 15 kHz - - standby mode standby mode 0 - - V mV mV
Standby condition standby voltage standby current switch-on current 2 100 40 V A A
2000 Mar 08
7
Philips Semiconductors
Product specification
22 W BTL or 2 x 11 W stereo power amplifier
AC CHARACTERISTICS VP = 14.4 V; RL = 4 ; f = 1 kHz; Tamb = 25 C; unless otherwise specified. SYMBOL PARAMETER CONDITIONS MIN. TYP.
TDA1519C
MAX.
UNIT
Stereo application (see Fig.6) Po output power note 1 THD = 0.5% THD = 10% RL = 2 ; note 1 THD = 0.5% THD = 10% THD fro(l) fro(h) Gv(cl) SVRR total harmonic distortion low frequency roll-off high frequency roll-off closed-loop voltage gain supply voltage ripple rejection on; notes 3 and 4 on; notes 3 and 5 mute; notes 3 and 6 standby; notes 3 and 6 Zi Vn(o)(rms) input impedance noise output voltage (RMS value) note 7 on; RS = 0 on; RS = 10 k mute; note 8 cs Gv(ub) Po channel separation channel unbalance RS = 10 k - - - 40 - note 1 THD = 0.5% THD = 10% output power at VP = 13.2 V note 1 THD = 0.5% THD = 10% THD Bp total harmonic distortion power bandwidth Po = 1 W THD = 0.5%; Po = -1 dB; with respect to 15 W -1 dB; note 2 -1 dB - - - - 13 17.5 0.1 35 to 15000 45 - 46 - - - W W % Hz 15 20 17 22 - - W W 150 250 120 - 0.1 - 500 - - 1 V V V dB dB Po = 1 W -3 dB; note 2 -1 dB 7.5 10 - - 20 39 40 45 45 80 50 8.5 11 0.1 45 - 40 - - - - 60 - - - - - 41 - - - - 75 W W % Hz kHz dB dB dB dB dB k 4 5.5 5 6.0 - - W W
BTL application (see Fig.7) output power
fro(l) fro(h) Gv(cl)
low frequency roll-off high frequency roll-off closed-loop voltage gain
- 20 45
- - 47
Hz kHz dB
2000 Mar 08
8
Philips Semiconductors
Product specification
22 W BTL or 2 x 11 W stereo power amplifier
SYMBOL SVRR PARAMETER supply voltage ripple rejection CONDITIONS on; notes 3 and 4 on; notes 3 and 5 mute; notes 3 and 6 standby; notes 3 and 6 Zi Vn(o)(rms) input impedance noise output voltage (RMS value) note 7 on; RS = 0 on; RS = 10 k mute; note 8 Notes 1. Output power is measured directly at the output pins of the IC. 2. Frequency response externally fixed. - - - 200 350 180 MIN. 34 48 48 80 25 - - - - 30 TYP.
TDA1519C
MAX. - - - - 38 - 700 -
UNIT dB dB dB dB k V V V
3. Ripple rejection measured at the output with a source impedance of 0 (maximum ripple amplitude of 2 V). 4. Frequency f = 100 Hz. 5. Frequency between 1 and 10 kHz. 6. Frequency between 100 Hz and 10 kHz. 7. Noise voltage measured in a bandwidth of 20 Hz to 20 kHz. 8. Noise output voltage independent of RS (Vi = 0 V).
2000 Mar 08
9
Philips Semiconductors
Product specification
22 W BTL or 2 x 11 W stereo power amplifier
APPLICATION INFORMATION
TDA1519C
handbook, full pagewidth
standby switch 100 F 3 input reference voltage internal 1/2 VP 8 7 100 nF 2200 F VP
-
60 k 220 nF non-inverting input 1
TDA1519C
+
40 dB
+
40 dB
-
60 k 9 220 nF inverting input
2
5
4
6
MGL493
signal ground
power ground 1000 F
Fig.6 Stereo application diagram (SOT131-2 and SOT354-1).
handbook, full pagewidth
standby switch VP 3 input reference voltage internal 1/2 VP 8 7 100 nF 2200 F
-
60 k 220 nF non-inverting input 1
TDA1519C
+
40 dB
+
40 dB
-
60 k 9
to pin 9
2
5
4
6
MGL494
to pin 1
signal ground
power ground
RL = 4
Fig.7 BTL application diagram (SOT131-2 and SOT354-1).
2000 Mar 08
10
Philips Semiconductors
Product specification
22 W BTL or 2 x 11 W stereo power amplifier
TDA1519C
handbook, halfpage
60
MGR539
Iq(tot) (mA)
50
40
30
0
4
8
12
16 VP (V)
20
Fig.8 Total quiescent current (Iq(tot)) as a function of supply voltage (VP).
handbook, halfpage
30
MGR540
Po (W) 20
THD = 10%
10 0.5%
0
0
4
8
12
16 VP (V)
20
Fig.9 Output power (Po) as a function of supply voltage (VP) for BTL application at RL = 4 ; f = 1 kHz.
2000 Mar 08
11
Philips Semiconductors
Product specification
22 W BTL or 2 x 11 W stereo power amplifier
TDA1519C
MGR541
handbook, halfpage
12
THD (%) 8
4
0 10-1
1
10
Po (W)
102
Fig.10 Total harmonic distortion (THD) as a function of output power (Po) for BTL application at RL = 4 ; f = 1 kHz.
MGR542
handbook, halfpage
0.6
THD (%) 0.4
0.2
0 10
102
103
f (Hz)
104
Fig.11 Total harmonic distortion (THD) as a function of operating frequency (f) for BTL application at RL = 4 ; Po = 1 W.
2000 Mar 08
12
Philips Semiconductors
Product specification
22 W BTL or 2 x 11 W stereo power amplifier
PACKAGE OUTLINES SIL9P: plastic single in-line power package; 9 leads
TDA1519C
SOT131-2
non-concave x Dh
D Eh
view B: mounting base side d A2
B seating plane j E
A1 b
L
c 1 Z e bp wM 0 5 scale DIMENSIONS (mm are the original dimensions) UNIT mm Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION SOT131-2 REFERENCES IEC JEDEC EIAJ EUROPEAN PROJECTION A1 max. 2.0 A2 4.6 4.4 b max. 1.1 bp 0.75 0.60 c 0.48 0.38 D (1) 24.0 23.6 d 20.0 19.6 Dh 10 E (1) 12.2 11.8 e 2.54 Eh 6 j 3.4 3.1 L 17.2 16.5 Q 2.1 1.8 w 0.25 x 0.03 Z (1) 2.00 1.45 10 mm 9 Q
ISSUE DATE 95-03-11 99-12-17
2000 Mar 08
13
Philips Semiconductors
Product specification
22 W BTL or 2 x 11 W stereo power amplifier
TDA1519C
SMS9P: plastic surface mounted single in-line power package; 9 leads
SOT354-1
D
y
non-concave x
d Dh
heatsink
A2
heatsink Eh j E
Q A1 L Lp c 9 Z e bp wM 1 (A3) A
0
5 scale
10 mm
DIMENSIONS (mm are the original dimensions) UNIT mm A 4.9 4.2 A1 0.35 0.05 A2 4.6 4.4 A3 0.25 bp 0.75 0.60 c 0.48 0.38 D(1) d Dh 10 E(1) e Eh 6 j 3.4 3.1 L 7.4 6.6 Lp 3.4 2.8 Q 2.1 1.9 w x y 0.15 Z(1) 2.00 1.45 3 0
24.0 20.0 23.6 19.6
12.2 2.54 11.8
0.25 0.03
Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION SOT354-1 REFERENCES IEC JEDEC EIAJ EUROPEAN PROJECTION
ISSUE DATE 98-10-08 99-12-17
2000 Mar 08
14
Philips Semiconductors
Product specification
22 W BTL or 2 x 11 W stereo power amplifier
TDA1519C
HSOP20: plastic, heatsink small outline package; 20 leads; low stand-off height
SOT418-2
E D x
A X
c y E2 HE vM A
D1 D2 1 pin 1 index Q A2 E1 A4 Lp detail X 20 Z e bp 11 wM (A3) A 10
0
5 scale
10 mm
DIMENSIONS (mm are the original dimensions) UNIT mm A A2 max. 3.5 3.5 3.2 A3 0.35 A4(1) bp c D(2) D1 D2 1.1 0.9 E(2) 11.1 10.9 E1 6.2 5.8 E2 2.9 2.5 e 1.27 HE 14.5 13.9 Lp 1.1 0.8 Q 1.7 1.5 v w x y Z 2.5 2.0 8 0
+0.12 0.53 0.32 16.0 13.0 -0.02 0.40 0.23 15.8 12.6
0.25 0.25 0.03 0.07
Notes 1. Limits per individual lead. 2. Plastic or metal protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION SOT418-2 REFERENCES IEC JEDEC EIAJ EUROPEAN PROJECTION
ISSUE DATE 98-02-25 99-11-12
2000 Mar 08
15
Philips Semiconductors
Product specification
22 W BTL or 2 x 11 W stereo power amplifier
HSOP20: plastic, heatsink small outline package; 20 leads
TDA1519C
SOT397-1
D
E E2
A X
c y HE vM A
D1 D2 20 11
Q A2 E1 pin 1 index A1 A4 (A3) Lp detail X 1 Z e 10 bp wM A
0
5 scale
10 mm
DIMENSIONS (mm are the original dimensions) UNIT mm A A1 max. 3.6 0.3 0.1 A2 3.3 3.0 A3 0.35 A4 0.1 0 bp c D(1) D1 D2 1.1 0.9 E(1) 11.1 10.9 E1 6.2 5.8 E2 2.9 2.5 e 1.27 HE 14.5 13.9 Lp 1.1 0.8 Q 1.5 1.4 v w y 0.1 Z 2.5 2.0 8 0
0.53 0.32 16.0 13.0 0.40 0.23 15.8 12.6
0.25 0.25
Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION SOT397-1 REFERENCES IEC JEDEC EIAJ EUROPEAN PROJECTION
ISSUE DATE 97-11-03 99-11-12
2000 Mar 08
16
Philips Semiconductors
Product specification
22 W BTL or 2 x 11 W stereo power amplifier
SOLDERING Introduction This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our "Data Handbook IC26; Integrated Circuit Packages" (document order number 9398 652 90011). There is no soldering method that is ideal for all IC packages. Wave soldering is often preferred when through-hole and surface mount components are mixed on one printed-circuit board. However, wave soldering is not always suitable for surface mount ICs, or for printed-circuit boards with high population densities. In these situations reflow soldering is often used. Through-hole mount packages SOLDERING BY DIPPING OR BY SOLDER WAVE The maximum permissible temperature of the solder is 260 C; solder at this temperature must not be in contact with the joints for more than 5 seconds. The total contact time of successive solder waves must not exceed 5 seconds. The device may be mounted up to the seating plane, but the temperature of the plastic body must not exceed the specified maximum storage temperature (Tstg(max)). If the printed-circuit board has been pre-heated, forced cooling may be necessary immediately after soldering to keep the temperature within the permissible limit. MANUAL SOLDERING Apply the soldering iron (24 V or less) to the lead(s) of the package, either below the seating plane or not more than 2 mm above it. If the temperature of the soldering iron bit is less than 300 C it may remain in contact for up to 10 seconds. If the bit temperature is between 300 and 400 C, contact may be up to 5 seconds. Surface mount packages REFLOW SOLDERING Reflow soldering requires solder paste (a suspension of fine solder particles, flux and binding agent) to be applied to the printed-circuit board by screen printing, stencilling or pressure-syringe dispensing before package placement. Several methods exist for reflowing; for example, infrared/convection heating in a conveyor type oven. Throughput times (preheating, soldering and cooling) vary between 100 and 200 seconds depending on heating method.
TDA1519C
Typical reflow peak temperatures range from 215 to 250 C. The top-surface temperature of the packages should preferable be kept below 230 C. WAVE SOLDERING Conventional single wave soldering is not recommended for surface mount devices (SMDs) or printed-circuit boards with a high component density, as solder bridging and non-wetting can present major problems. To overcome these problems the double-wave soldering method was specifically developed. If wave soldering is used the following conditions must be observed for optimal results: * Use a double-wave soldering method comprising a turbulent wave with high upward pressure followed by a smooth laminar wave. * For packages with leads on two sides and a pitch (e): - larger than or equal to 1.27 mm, the footprint longitudinal axis is preferred to be parallel to the transport direction of the printed-circuit board; - smaller than 1.27 mm, the footprint longitudinal axis must be parallel to the transport direction of the printed-circuit board. The footprint must incorporate solder thieves at the downstream end. * For packages with leads on four sides, the footprint must be placed at a 45 angle to the transport direction of the printed-circuit board. The footprint must incorporate solder thieves downstream and at the side corners. During placement and before soldering, the package must be fixed with a droplet of adhesive. The adhesive can be applied by screen printing, pin transfer or syringe dispensing. The package can be soldered after the adhesive is cured. Typical dwell time is 4 seconds at 250 C. A mildly-activated flux will eliminate the need for removal of corrosive residues in most applications. MANUAL SOLDERING Fix the component by first soldering two diagonally-opposite end leads. Use a low voltage (24 V or less) soldering iron applied to the flat part of the lead. Contact time must be limited to 10 seconds at up to 300 C. When using a dedicated tool, all other leads can be soldered in one operation within 2 to 5 seconds between 270 and 320 C. 17
2000 Mar 08
Philips Semiconductors
Product specification
22 W BTL or 2 x 11 W stereo power amplifier
Suitability of IC packages for wave, reflow and dipping soldering methods
TDA1519C
SOLDERING METHOD MOUNTING PACKAGE WAVE Through-hole mount DBS, DIP, HDIP, SDIP, SIL Surface mount BGA, LFBGA, SQFP, TFBGA HBCC, HLQFP, HSQFP, HSOP, HTQFP, HTSSOP, SMS PLCC(4), SO, SOJ LQFP, QFP, TQFP SSOP, TSSOP, VSO Notes 1. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum temperature (with respect to time) and body size of the package, there is a risk that internal or external package cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the Drypack information in the "Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods". 2. For SDIP packages, the longitudinal axis must be parallel to the transport direction of the printed-circuit board. 3. These packages are not suitable for wave soldering as a solder joint between the printed-circuit board and heatsink (at bottom version) can not be achieved, and as solder may stick to the heatsink (on top version). 4. If wave soldering is considered, then the package must be placed at a 45 angle to the solder wave direction. The package footprint must incorporate solder thieves downstream and at the side corners. 5. Wave soldering is only suitable for LQFP, QFP and TQFP packages with a pitch (e) equal to or larger than 0.8 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm. 6. Wave soldering is only suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than 0.65 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm. DEFINITIONS Data sheet status Objective specification Preliminary specification Product specification Limiting values Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Where application information is given, it is advisory and does not form part of the specification. LIFE SUPPORT APPLICATIONS These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale. 2000 Mar 08 18 This data sheet contains target or goal specifications for product development. This data sheet contains preliminary data; supplementary data may be published later. This data sheet contains final product specifications. suitable(2) not suitable not suitable(3) suitable not recommended(4)(5) not recommended(6) REFLOW(1) DIPPING - suitable suitable suitable suitable suitable suitable - - - - -
Philips Semiconductors
Product specification
22 W BTL or 2 x 11 W stereo power amplifier
NOTES
TDA1519C
2000 Mar 08
19
Philips Semiconductors - a worldwide company
Argentina: see South America Australia: 3 Figtree Drive, HOMEBUSH, NSW 2140, Tel. +61 2 9704 8141, Fax. +61 2 9704 8139 Austria: Computerstr. 6, A-1101 WIEN, P.O. Box 213, Tel. +43 1 60 101 1248, Fax. +43 1 60 101 1210 Belarus: Hotel Minsk Business Center, Bld. 3, r. 1211, Volodarski Str. 6, 220050 MINSK, Tel. +375 172 20 0733, Fax. +375 172 20 0773 Belgium: see The Netherlands Brazil: see South America Bulgaria: Philips Bulgaria Ltd., Energoproject, 15th floor, 51 James Bourchier Blvd., 1407 SOFIA, Tel. +359 2 68 9211, Fax. +359 2 68 9102 Canada: PHILIPS SEMICONDUCTORS/COMPONENTS, Tel. +1 800 234 7381, Fax. +1 800 943 0087 China/Hong Kong: 501 Hong Kong Industrial Technology Centre, 72 Tat Chee Avenue, Kowloon Tong, HONG KONG, Tel. +852 2319 7888, Fax. +852 2319 7700 Colombia: see South America Czech Republic: see Austria Denmark: Sydhavnsgade 23, 1780 COPENHAGEN V, Tel. +45 33 29 3333, Fax. +45 33 29 3905 Finland: Sinikalliontie 3, FIN-02630 ESPOO, Tel. +358 9 615 800, Fax. +358 9 6158 0920 France: 51 Rue Carnot, BP317, 92156 SURESNES Cedex, Tel. +33 1 4099 6161, Fax. +33 1 4099 6427 Germany: Hammerbrookstrae 69, D-20097 HAMBURG, Tel. +49 40 2353 60, Fax. +49 40 2353 6300 Hungary: see Austria India: Philips INDIA Ltd, Band Box Building, 2nd floor, 254-D, Dr. Annie Besant Road, Worli, MUMBAI 400 025, Tel. +91 22 493 8541, Fax. +91 22 493 0966 Indonesia: PT Philips Development Corporation, Semiconductors Division, Gedung Philips, Jl. Buncit Raya Kav.99-100, JAKARTA 12510, Tel. +62 21 794 0040 ext. 2501, Fax. +62 21 794 0080 Ireland: Newstead, Clonskeagh, DUBLIN 14, Tel. +353 1 7640 000, Fax. +353 1 7640 200 Israel: RAPAC Electronics, 7 Kehilat Saloniki St, PO Box 18053, TEL AVIV 61180, Tel. +972 3 645 0444, Fax. +972 3 649 1007 Italy: PHILIPS SEMICONDUCTORS, Via Casati, 23 - 20052 MONZA (MI), Tel. +39 039 203 6838, Fax +39 039 203 6800 Japan: Philips Bldg 13-37, Kohnan 2-chome, Minato-ku, TOKYO 108-8507, Tel. +81 3 3740 5130, Fax. +81 3 3740 5057 Korea: Philips House, 260-199 Itaewon-dong, Yongsan-ku, SEOUL, Tel. +82 2 709 1412, Fax. +82 2 709 1415 Malaysia: No. 76 Jalan Universiti, 46200 PETALING JAYA, SELANGOR, Tel. +60 3 750 5214, Fax. +60 3 757 4880 Mexico: 5900 Gateway East, Suite 200, EL PASO, TEXAS 79905, Tel. +9-5 800 234 7381, Fax +9-5 800 943 0087 Middle East: see Italy Netherlands: Postbus 90050, 5600 PB EINDHOVEN, Bldg. VB, Tel. +31 40 27 82785, Fax. +31 40 27 88399 New Zealand: 2 Wagener Place, C.P.O. Box 1041, AUCKLAND, Tel. +64 9 849 4160, Fax. +64 9 849 7811 Norway: Box 1, Manglerud 0612, OSLO, Tel. +47 22 74 8000, Fax. +47 22 74 8341 Pakistan: see Singapore Philippines: Philips Semiconductors Philippines Inc., 106 Valero St. Salcedo Village, P.O. Box 2108 MCC, MAKATI, Metro MANILA, Tel. +63 2 816 6380, Fax. +63 2 817 3474 Poland: Al.Jerozolimskie 195 B, 02-222 WARSAW, Tel. +48 22 5710 000, Fax. +48 22 5710 001 Portugal: see Spain Romania: see Italy Russia: Philips Russia, Ul. Usatcheva 35A, 119048 MOSCOW, Tel. +7 095 755 6918, Fax. +7 095 755 6919 Singapore: Lorong 1, Toa Payoh, SINGAPORE 319762, Tel. +65 350 2538, Fax. +65 251 6500 Slovakia: see Austria Slovenia: see Italy South Africa: S.A. PHILIPS Pty Ltd., 195-215 Main Road Martindale, 2092 JOHANNESBURG, P.O. Box 58088 Newville 2114, Tel. +27 11 471 5401, Fax. +27 11 471 5398 South America: Al. Vicente Pinzon, 173, 6th floor, 04547-130 SAO PAULO, SP, Brazil, Tel. +55 11 821 2333, Fax. +55 11 821 2382 Spain: Balmes 22, 08007 BARCELONA, Tel. +34 93 301 6312, Fax. +34 93 301 4107 Sweden: Kottbygatan 7, Akalla, S-16485 STOCKHOLM, Tel. +46 8 5985 2000, Fax. +46 8 5985 2745 Switzerland: Allmendstrasse 140, CH-8027 ZURICH, Tel. +41 1 488 2741 Fax. +41 1 488 3263 Taiwan: Philips Semiconductors, 6F, No. 96, Chien Kuo N. Rd., Sec. 1, TAIPEI, Taiwan Tel. +886 2 2134 2886, Fax. +886 2 2134 2874 Thailand: PHILIPS ELECTRONICS (THAILAND) Ltd., 209/2 Sanpavuth-Bangna Road Prakanong, BANGKOK 10260, Tel. +66 2 745 4090, Fax. +66 2 398 0793 Turkey: Yukari Dudullu, Org. San. Blg., 2.Cad. Nr. 28 81260 Umraniye, ISTANBUL, Tel. +90 216 522 1500, Fax. +90 216 522 1813 Ukraine: PHILIPS UKRAINE, 4 Patrice Lumumba str., Building B, Floor 7, 252042 KIEV, Tel. +380 44 264 2776, Fax. +380 44 268 0461 United Kingdom: Philips Semiconductors Ltd., 276 Bath Road, Hayes, MIDDLESEX UB3 5BX, Tel. +44 208 730 5000, Fax. +44 208 754 8421 United States: 811 East Arques Avenue, SUNNYVALE, CA 94088-3409, Tel. +1 800 234 7381, Fax. +1 800 943 0087 Uruguay: see South America Vietnam: see Singapore Yugoslavia: PHILIPS, Trg N. Pasica 5/v, 11000 BEOGRAD, Tel. +381 11 3341 299, Fax.+381 11 3342 553
For all other countries apply to: Philips Semiconductors, International Marketing & Sales Communications, Building BE-p, P.O. Box 218, 5600 MD EINDHOVEN, The Netherlands, Fax. +31 40 27 24825 (c) Philips Electronics N.V. 2000
Internet: http://www.semiconductors.philips.com
SCA 69
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights.
Printed in The Netherlands
753503/02/pp20
Date of release: 2000
Mar 08
Document order number:
9397 750 06633

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